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台积电将负责高通骁龙8Gen3芯片的大部分订单 - 站长搜索
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台积电将负责高通骁龙8Gen3芯片的大部分订单

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2023-01-03 09:57:02 转载来源: 网络整理/侵权必删

高通的下一代骁龙8芯片(第三代)预计将在2024年为大多数旗舰产品提供动力。有传言称,这些芯片来自三星和台积电,以降低制造成本

高通的下一代骁龙8芯片(第三代)预计将在2024年为大多数旗舰产品提供动力。有传言称,这些芯片来自三星和台积电,以降低制造成本。然而,根据一份报告,由于其3纳米制程80%的高成品率,台积电将生产大部分的骁龙芯片。



Business Next的一份报告指出,台积电的3纳米制程的成品率约为60%-70%,在某些情况下甚至达到80%左右。影响成品率的关键因素很多,包括材料、参数和机器,这些因素都是可变的。

如果报告提供的数据可以作为依据,苹果和高通的下一代芯片A17仿生和骁龙8 Gen 3都不会出现发货问题。

由于这一制造过程增加了成本和复杂性,高通可能不得不向智能手机合作伙伴收取更高的每芯片费用。这应该意味着,与骁龙8 Gen 2相比,骁龙8 Gen 3的智能手机价格将略高一些。

标签: 台积 负责 高通 骁龙 8Gen3 芯片 大部分 订单


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