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AMD获新专利:实现多芯GPU的L3缓存共享技术 - 站长搜索
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AMD获新专利:实现多芯GPU的L3缓存共享技术

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2021-04-07 09:34:06 转载来源: 中关村在线

在GPU图形芯片上,AMD的RDNA2架构最终在性能上能够与NVIDIA的RTX 30系列(光学跟踪除外)针锋相对了,下一代RDNA3能效提高50%,加把劲有可能全面超越NVIDIA。RDNA3架构芯片最早也能在今年年底亮相,但更有可能在2022年和Zen4一起问世,实锤爆料还没透露多少

GPU图形芯片上,AMD的RDNA2架构最终在性能上能够与NVIDIA的RTX 30系列(光学跟踪除外)针锋相对了,下一代RDNA3能效提高50%,加把劲有可能全面超越NVIDIA。


RDNA3架构芯片最早也能在今年年底亮相,但更有可能在2022年和Zen4一起问世,实锤爆料还没透露多少。但RDNA3有可能采用MCM多芯封装芯片设计,走上Zen2/Zen3 CPU芯片道路。

AMD此前已经申请了GPU小芯片设计专利。不久前,有报料称大核心Navi 31由两组MCM芯片组成,每组80个CU单元,总计160组CU单元,规模翻倍,理论上性能也会翻倍。

多核封装可以暴力增加计算规模,实现性能大提升,但是会有代价,多芯片之间的通讯延迟是个问题。

在这方面,AMD最近获得了新的专利,名为ACTIVE BRIDGE CHIPLET WITH INTEGRATED  CACHE(带有集成缓存的主动式桥接小芯片),实现了多芯GPU的L3缓存共享技术,可以大大降低芯片间的延迟。

虽然技术专利不一定意味着可以应用,但是根据AMD申请多芯片专利的情况来看,RDNA3架构的GPU上多芯封装是大势所趋。随着Zen2/Zen3的探索,AMD在这方面已经得心应手。

标签: AMD 获新 专利 实现 多芯 GPU L3 缓存 共享


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